AMD's Radeon R9 380X 'Fiji XT' GPU Die Size and GCN Specification Leaked - Releasing in June 2020 - hubermals1979

Some very interesting information was posted over at Bitsandchips.it recently. The report states apparent inside information about AMD's upcoming Fiji XT die claiming that information technology boasts a die size of it of 550mm². The report as wel lists other information and concludes with the fact that AMD will be emotional the R9 380X former in June, just before Computex 2020.

A very handily named poster of an over-the-hill TV Show. @ZDF Enterprises

Fiji XT has a die sizing of 550mm², rocks GCN 1.2 and HBM, emotional before Computex 2020 - Alleges Italian Report card

Let's go step aside step over the claims ready-made away the article. Firstly, Fiji XT ostensibly has a die size of 550mm². That is a pretty Brobdingnagian go bad, considering that Hawaii was round 438mm². However, that still is well away from TSMC's 28nm fabrication limit (which is 600-650mm² depending on the exact process).  For those interested, if you remember the die shot analysis of the GM200 I did, I arrived at an answer of 632mm² with a high confidence and fault of margin of 2.5%. That equates to ~619mm² connected the lower bound. Even if you were to assume a glower confidence and 5% MoE, that equates to ~600mm² on the lower bound - still a large die than the 550mm² mentioned here.

The second thing mentioned is something we feature far-famed and reported for a polysyllabic time - HBM memory. Unless AMD changes its mind, HBM is definitely on track. IT could ejaculate Eastern Samoa a pure HBM memory standard completely replacing GDDR5 memory board or it could come as a a Hybrid retention standard with the HBM playing as pilo. Either way,storage bandwidth issues are about to become non existent. Thirdly they mention that with Republic of Fiji AMD should chemise to a better, more efficient tiled version of GCN: 1.2. This is the same GCN architecture that appeared along Kingdom of Tonga and should leave a very decent subject area boost. Couple that with over 550mm² of die size above and you hold a very formidable chip.

Now I am fairly confident that the analytic thinking I did would meet atleast the 5% error of margin (or insufficient confidence), and then that puts the GM200 core at exactly 50mm² more die area than the Republic of Fiji XT GPU at minimum. However, the Fiji XT is really the R9 380X not the R9 390X. The R9 390X should be titled Bermuda XT. I find it real interesting that AMD has left itself a margin to expand on the 28nm process; or could it be that their financial troubles are greater than anticipated? Tape dies is precise very expensive, thus I don't see the R9 390X arriving any time soon, meaning the Fiji GPU bequeath remain the meridian tier AMD product for quite some fourth dimension. The GPU is sentiment to have 300W TDP (just gues the performance with that kinda TDP) something I wholeheartedly support connected high end GPUs. As you probably already know, AMD will be using a hybrid ice chest to cool this monster. It is hoped-for to arrive in June 2020, shortly before Computex, Taipeh.

Source: https://wccftech.com/amds-fiji-xt-gpu-monolithic-die-surface-area-550mm2-claims-italian-report/

Posted by: hubermals1979.blogspot.com

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